Item Specifics
| Seller Item Code | EQ25E30 | Vintage | 2018 |
|---|---|---|---|
| Wafer size | 300MM |
| Seller Item Code | EQ25E30 | Vintage | 2018 |
|---|---|---|---|
| Wafer size | 300MM |
| 1. Product Name & Description | 2300 E6 |
| 2. Equipment manufacturer | LAM |
| 3. Configuration & Features | Flex HXP |
| 4. Process | Reactive Ion Etching |
| 5.Equipment list |
EFEM x1 MF x1 Flex HXP CHAMBER x6 RF Power Supply Cart x6 Gas Delivery Module x1 GAS Box x6 ESC ( 839-102001-136 ) x6 |